회사 소식 Innovative application of UVLED curing equipment in the field of sensor fixation

Innovative application of UVLED curing equipment in the field of sensor fixation

  UVLED curing technology, with its precise, low-temperature properties, efficiently cures adhesives and encapsulation materials, significantly improving sensor production efficiency and reliability. It is particularly well-suited for high-precision applications such as automotive and medical applications, providing key technical support for the miniaturization and intelligent development of sensors.The application of UVLED curing equipment in sensor mounting relies on precisely controlling ultraviolet light to achieve rapid curing of adhesives, encapsulation materials, and protective coatings, thereby improving sensor production efficiency and long-term reliability. The following describes specific application scenarios, technical advantages, and industry value:

  Adhesive curing: Used to bond core sensor components (such as MEMS chips and detection probes) to substrates. UVLED equipment precisely illuminates the bonding area with ultraviolet light of a specific wavelength, instantly curing the adhesive within a few seconds to tens of seconds. This avoids the thermal damage to components caused by traditional heat curing processes and ensures the sensor's precise performance. For example, at the optical coupling point of a fiber optic sensor, UVLED curing technology maintains optical alignment accuracy during the adhesive curing process, ensuring stable signal transmission.

  Encapsulation and Protection: UVLED-cured transparent encapsulation materials are used for sensor housings or internal circuitry, creating a moisture- and dust-resistant protective layer, significantly enhancing the sensor's resistance to environmental interference.This advantage lies in its strong UV light penetration, enabling the curing of highly transparent resins. This is ideal for encapsulating miniaturized sensors (such as temperature and humidity sensors in IoT devices) without affecting sensor signal acquisition and transmission.

  3D Structure Forming: In the manufacture of flexible sensors or sensors with complex structures, UVLED technology can cure photosensitive resins layer by layer, achieving precise molding of miniaturized and custom-shaped structures, meeting the sensor's morphological design requirements for specialized scenarios.

  Technical Advantages 

  Precision and Efficiency: Supports multi-wavelength UV light output from 254-980nm, tailored to the characteristics of various photosensitive materials. Curing speed is over 30% faster than traditional UV mercury lamps, significantly shortening production cycles.
  Low-Temperature Process: This cold light source technology generates no heat radiation, preventing thermal deformation or performance degradation of sensitive components such as polymer materials in sensors and biochips.

  Energy-Efficient and Durable: The UVLED light source boasts a lifespan exceeding 20,000 hours and consumes only one-fifth the energy of traditional mercury lamps, making it suitable for large-scale continuous production and reducing long-term operating costs.

  Industry Value

  Improving Product Yield: Reduces sensor failure caused by thermal stress, making it particularly suitable for applications requiring extremely high reliability, such as automotive tire pressure monitoring and medical wearables.
  Supporting Miniaturization: Adapts to the precision curing requirements of micro-devices such as mobile phone gyroscopes and AR/VR sensors, providing process support for the miniaturization and high integration of sensors.

  UVLED curing technology has become a key process in sensor manufacturing. With continued innovation in photocurable materials, its application in the sensor field will further expand, driving breakthroughs in sensors towards high integration and intelligentization.