|
제품 상세 정보:
|
| 색상: | 투명한 검정색 | 점도(25°C): | 6000±1000mPa.s |
|---|---|---|---|
| 경화조건: | 600mJ/cm2(LED UV) | 경도: | 쇼어 D 40 |
| 유리전이온도(Tg): | 10' Ｃ | 유전 강도: | 20 KV / 밀리미터 |
| 유통기한: | 12개월(8~28°C) | 포장: | 50g / 1kg |
| 애플리케이션: | BGA 칩 강화, 부품 바닥 고정 | ||
| 강조하다: | UV curable adhesive for BGA chips,Fast curing UV adhesive high adhesion,UV cure adhesive component bottom fixation |
||
Fast Curing UV Curable Adhesive Fast Curing UV Curable Adhesive is a transparent black, LED-curable adhesive specially formulated for BGA chip stiffening and component bottom fixation. It offers high adhesion with excellent flexibility, low shrinkage and low dielectric constant, high thixotropy with good color visibility for easy dispensing, and LED 3-5 second fast curing, delivering reliable stiffening and protection for sensitive electronic components. Key Features Fast
담당자: Eric Hu
전화 번호: 0086-13510152819
Korean
전체 등급
등급 스냅샷
다음은 모든 평점의 분포입니다.모든 리뷰